Home    Company News    IOTA PDMS Crosslinked Polymer: Insulation and Heat Resistance for Electronic Encapsulation Materials

IOTA PDMS Crosslinked Polymer: Insulation and Heat Resistance for Electronic Encapsulation Materials

Hits: 801 img

In the field of electronic encapsulation, IOTA PDMS crosslinked polymer, with its excellent electrical insulation and heat resistance, has become an ideal material to enhance the reliability of electronic devices. This colorless, transparent gel not only effectively covers complex electronic components but also maintains stable performance in high-temperature environments, bringing a new solution to the electronics industry.

Product Highlights:

  • Excellent Electrical Insulation: Prevents short circuits in electrical devices, improving the overall reliability of the equipment.
  • Strong Heat Resistance: Maintains stability in high-temperature environments, extending the lifespan of electronic devices.
  • Low Volatility: Reduces contamination caused by volatilization, particularly suitable for semiconductor manufacturing and electronic encapsulation.

Applications: IOTA PDMS crosslinked polymer is widely used in integrated circuits (ICs), semiconductor encapsulation materials, and electronic components requiring high insulation and heat resistance.

Technical Specifications:

  • Appearance: Colorless, transparent gel
  • Non-volatile content: 15–20%
  • Viscosity: 100,000–300,000 cP

Packaging and Storage: The product is packaged in 20kg plastic drums or 200kg steel drums. Store in a cool, dry place. Shelf life: 2 years.

The introduction of IOTA PDMS crosslinked polymer offers an efficient and reliable solution for the electronics encapsulation industry, with potential to show its unique value in more high-performance electronic applications.

Recommend

    Online QQ Service, Click here

    QQ Service

    What's App