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Low-Viscosity Phenyl Hydrogen-Containing Silicone Oil – Ideal for Resin Modification and High-Performance Composites

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IOTA 231 is a low-viscosity, hydrogen-terminated linear phenyl silicone oil with low molecular weight and controllable reactivity. It can be used not only as a crosslinker but also for the modification of phenyl silicone resins and the preparation of high-performance composites, enhancing heat resistance, hydrophobicity, and mechanical strength of materials.


Key Features

  • Low Viscosity (1–10 mm²/s): Good flowability, easy mixing and impregnation.

  • Controllable Reactivity: Si-H bonds can undergo hydrosilylation with alkenyl groups under platinum catalysis under mild conditions.

  • Phenyl Functional Groups: Imparts better thermal stability and UV aging resistance to modified materials.

  • Good Dilutability and Compatibility: Can be blended with various silicone resins and oils.


Technical Specifications

Parameter Value
Appearance Colorless transparent viscous liquid
Specific Gravity 0.99–1.00
Refractive Index (20°C) 1.50–1.51
Viscosity (25°C, mm²/s) 1–10
Flash Point >110 °C
Hydrogen Content (H%) 0.20–0.60

Main Applications (Modification and Composites Field)

  • Phenyl Silicone Resin Modification: Introduces reactive hydrogen groups to adjust crosslinking density and surface properties of resins.

  • High-Performance Encapsulation Materials: Used for high-temperature resistant encapsulation and insulating protective layers for electronic components.

  • High-Temperature Resistant Coatings: Serves as a crosslinking component or modifying additive to improve thermal stability and adhesion of coatings.

  • Composite Matrix Modification: Enhances high-temperature mechanical properties of silicone-based composite materials.


Why Choose IOTA 231

With its low viscosity, phenyl functional groups, and hydrogen-terminated reactive structure, IOTA 231 offers unique advantages in high-performance resin modification, encapsulation materials, and coating applications. It provides materials engineers with a more flexible and heat-resistant pathway for silicone modification.

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