Solid Molding Powder|Fast Curing|High Crosslinking Density|High Tg|Excellent Heat Resistance

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Product Profile

IOTA 6ND32 is a solid silicone resin containing benzoxazine, alkoxy, silanol, and other reactive functional groups. It can be cured via compression molding, featuring fast curing speed, high crosslinking density, and a high glass transition temperature (Tg), along with excellent heat resistance. As a molding powder, it is widely used in high-temperature resistant coatings, aerospace, and electrical and electronics applications.

Technical Specifications

Parameter Specification
Appearance Solid powder
K⁺ content < 0.03 wt.%
Cl⁻ content < 0.03 wt.%

Product Features

  • ✅ Solid powder form – convenient for storage, transport, and weighing; ideal for compression molding processes

  • ✅ Fast curing speed – shortens molding cycles, improving production efficiency

  • ✅ High crosslinking density – forms a dense three-dimensional network after curing for stable performance

  • ✅ High glass transition temperature – maintains excellent dimensional stability at elevated temperatures

  • ✅ Excellent heat resistance – long-term thermal stability

  • ✅ Multiple reactive groups – benzoxazine, alkoxy, silanol, etc., provide abundant crosslinking sites

  • ✅ High purity – K⁺ and Cl⁻ content both below 0.03 wt.%, meeting the cleanliness requirements of electrical and electronic applications

Applications

  • High-temperature resistant coatings – protective coating materials for high-temperature environments

  • Aerospace – thermal protection systems, ablative materials

  • Electrical & electronics – high-performance insulating materials, high-reliability encapsulation

  • Molded products – compression molding of complex-shaped parts

Curing Method

  • Compression molding – fast curing through heating and pressing

  • Specific molding parameters (temperature, pressure, time) can be customized and optimized based on customer requirements

Why Choose IOTA 6ND32?

✅ Solid powder form – easy storage, transport, and accurate weighing
✅ Fast curing – high production efficiency
✅ High crosslinking density & high Tg – dimensional stability at high temperatures
✅ Excellent heat resistance – withstands extreme thermal environments
✅ Ultra-low K⁺ and Cl⁻ content (<0.03 wt.%) – high purity for critical applications
✅ Suitable for aerospace, electrical and electronics high-end applications
✅ Compression molding – mature process, high precision parts

For samples, compression molding recommendations, or technical support, please feel free to contact us.

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