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IOTA 61257 is a POSS product featuring a well-defined cage-like structure with eight dimethylsilyloxy functional groups attached to a siloxane cage core. This unique "inorganic core-organic shell" structure combines the thermal stability of silica with the compatibility of silicones, enabling precise molecular-level modification of polymer materials -5. As a white powder with high purity, it is suitable for electronic encapsulation, optical coatings, aerospace composites, and other advanced applications.
| Parameter | Detail |
|---|---|
| CAS No. | 125756-69-6 -1-2 |
| Molecular Formula | C₁₆H₅₆O₂₀Si₁₆ -1-2 |
| Molecular Weight | 1017.97 g/mol -1-2 |
| Parameter | Specification |
|---|---|
| Appearance | White powder -1-4 |
| Purity | ≥95% -1-9 |
Nanoscale cage structure – molecular dimensions of approximately 1.5 nm for molecular-level dispersion -3
Reactive hydride groups – contains Si–H bonds for platinum-catalyzed hydrosilylation reactions -3-5
Enhanced thermal stability – cage structure effectively restricts polymer chain mobility, increasing decomposition temperature -5
Low dielectric constant – nano-voids within the structure effectively reduce dielectric constant for high-frequency applications such as 5G communications -5-7
Mechanical reinforcement – uniform nanoscale dispersion improves modulus, hardness, and wear resistance -3-5
Flame retardant and smoke suppression – forms a dense silicon-carbon char layer during combustion -5
Excellent thermal and chemical stability -11
1. High-Performance Polymer Modification
Acts as a nano-crosslinker or grafting monomer for polysiloxanes, epoxy resins, polyimides, and other systems, significantly improving heat resistance, mechanical properties, and dimensional stability. Modified polysiloxanes can achieve Tg as low as -120°C, combining excellent low-temperature resistance with low dielectric constant -7.
2. Electronic Encapsulation and Insulating Materials
Low coefficient of thermal expansion reduces internal stress during thermal cycling, while low dielectric loss meets high-frequency, high-speed signal transmission requirements for chip encapsulation and circuit board insulation -5-7.
3. High-Performance Coatings and Functional Films
Improves hardness, scratch resistance, and weatherability of coating systems for specialty functional coatings -3.
4. Aerospace Composite Materials
Serves as structural and insulating materials, meeting performance requirements for aircraft in high-altitude, low-temperature environments and supporting stable electronic system operation -7.
Solubility: Soluble in THF and chloroform; slightly soluble in n-hexane -3
Storage: Store in a cool, dry, dark place in sealed containers -5
Notes: Use promptly after opening; prolonged air exposure may reduce activity; avoid contact with strong alkaline substances -3-5
✅ Nanoscale cage structure – excellent dispersibility
✅ Reactive hydride groups – participates in hydrosilylation reactions
✅ Multiple benefits: heat resistance + mechanical reinforcement + low dielectric properties + flame retardancy
✅ Suitable for high-value applications: electronics, aerospace, functional coatings
✅ High purity (≥95%) – consistent and reliable quality
For samples, technical support, or application recommendations, please feel free to contact us.
