Home    Company News    IOTA 61257 Octa(dimethylsiloxy)octasilsesquioxane: Precisely Engineered "Molecular Brick" for Next-Generation High-Performance Materials

IOTA 61257 Octa(dimethylsiloxy)octasilsesquioxane: Precisely Engineered "Molecular Brick" for Next-Generation High-Performance Materials

Hits: 370 img

In advanced fields such as high-performance polymer modification, electronic packaging, optical coatings, and aerospace composites, material breakthroughs often depend on molecular-level structural design. IOTA 61257 Octa(dimethylsiloxy)octasilsesquioxane is a well-defined cage-structured organic-inorganic hybrid nanomaterial. With its precise molecular architecture and high reactivity, it serves as an ideal nanoscale building block for advanced functional materials.

Product Introduction

IOTA 61257 belongs to the polyhedral oligomeric silsesquioxane (POSS) family. Its core is an eight-silicon cage framework constructed from silicon-oxygen bonds, with each of the eight corners bearing a dimethylsiloxy functional group. This unique "inorganic core – organic shell" structure combines the thermal stability of silica with the compatibility of silicones, making it a renowned "nano-additive" in the field of material modification.

Technical Specifications

Parameter Value
Product Code IOTA 61257
CAS No. 125756-69-6
Molecular Formula C₁₆H₅₆O₂₀Si₁₆
Molecular Weight 1017.97
Appearance White powder
Purity ≥95%

Product Features

  • Precise Nanostructure: Molecular size of approximately 1–3 nm; the cage framework provides a regular template for material modification

  • High Reactivity: Terminal Si–H bonds can undergo hydrosilylation and various other derivatization reactions to construct functionalized POSS

  • Organic-Inorganic Hybrid: Combines the compatibility of organic materials with the thermal stability, hardness, and scratch resistance of inorganic materials

  • Low Addition, High Return: An addition level of only 0.5–2% can increase the thermal decomposition temperature of polymers by 30–50°C

  • High Purity Assurance: ≥95% purity, strict quality control, and excellent batch-to-batch consistency

Typical Applications

Application Area Core Value Typical Scenarios
High-Performance Polymer Modification Improves thermal stability, mechanical properties, and flame retardancy LED encapsulation, engineering plastics, polyurethane elastomers
UV/EB-Curable Coatings Enhances hardness, scratch resistance, and weatherability Optical films, 3D printing materials, PCB protective layers
Electronic Encapsulation Materials Low dielectric constant, low coefficient of thermal expansion (CTE) Semiconductor packaging, high-frequency communication devices
Aerospace Composites Atomic oxygen resistance, improved interfacial adhesion Spacecraft protective coatings
Biomedical Materials Antimicrobial properties, controlled release, biocompatibility Medical device coatings, drug delivery carriers
Research Reagents Precursors for novel functional material synthesis University and institute R&D innovation

Key Application Advantages

1. Polymer Modifier

  • Improved Heat Resistance: The cage structure restricts polymer chain movement, significantly increasing thermal decomposition temperature

  • Mechanical Reinforcement: Uniform nanoscale dispersion increases modulus, hardness, and wear resistance

  • Reduced Dielectric Constant: Nano-sized cavities effectively lower the dielectric constant – suitable for 5G and other high-frequency applications

  • Flame Retardancy & Smoke Suppression: Forms a dense silica-char layer during combustion, providing both flame retardancy and smoke suppression

2. High-Performance Coatings

  • High Hardness & Scratch Resistance: The inorganic cage core imparts ceramic-like hardness to the coating, resisting scratches

  • Optical Transparency: Molecular-level dispersion does not scatter visible light, keeping the coating clear and transparent

  • Weather & Corrosion Resistance: Resists UV radiation, acid rain, and salt spray, extending coating service life

3. Electronic Encapsulation Materials

  • Low Stress: Low CTE reduces internal stress during thermal cycling

  • Low Dielectric Loss: Meets the requirements for high-frequency, high-speed signal transmission

Handling and Storage

  • Storage Conditions: Store in a cool, dry place away from light, in a sealed container

  • Precautions: Use promptly after opening; prolonged exposure to air may reduce active component content

Recommend

    Online QQ Service, Click here

    QQ Service

    What's App